Cov yam ntxwv khoom
1. Siab - precision Hluav Taws Xob Txuas
Muab cov chip ruaj khov - rau - {}}} qib probes kev sib txuas / socket,}} theem kev sib tw.
2. Cov teeb liab kev ncaj ncees optimization
Utilizes impedance-controlled routing, shielding, and low-noise materials to minimize signal distortion and crosstalk.
3. Multure - Txoj kev raws tu protocol
Txhawb lub siab siab - kev cuam tshuam ceev (piv txwv li, PCIE, DDR, USB) thiab sib xyaw} teeb liab (analog / rf) kuaj.
4. Thermal tswj lub peev xwm
Sib koom ua ke cov cua sov / ua kua txias cov channel kom ruaj khov rau hluav taws kub thaum kuaj (-55 degree}}} degree).
5. Configurabability & Modularity
Pab kom rov qab them tus nqi pin thiab hloov kho cov pob tw rau ntau pob khoom (BGA, QFN, CSP, thiab lwm yam).
6. Kev siab ntseeg siab & durability
Withstands >1 lab qhov ntxig; anti {- Cov ntaub qhwv cov khoom lag luam ntev.
7. Kev Tshawb Fawb Kev Sib Tw
Sib txuas nrog seamlessly nrog noj rau high - ceev cov ntsuas ntsuas thiab cov ntaub ntawv tsom xam.
8. Daim ntawv thov versatility
Themed Wafer Probing (Daim Ntawv Soj Ntsuam), Xeem Ntawv (Thauj Khoom), thiab System {}}}}}}}} {{{qib kuaj (sTT boards).
9. Cov kev ntsuas ntsuas kev ntsuas siab
Ua rau cov kev ntsuas sib txuas ntawm ntau daim chips, txo cov voj voog ntau lawm thiab lub suab sib cav sib ceg.
Khoom Daim Ntawv Thov Teb
Wafer -} theem
Kev sojntsuam phaib hu rau Wafer Pads ntawm Micron nplai
01
Kev Xeem Zaum Kawg
Load cov laug cam sib xyaw ua ke nrog cov nqaij ntim
02
System -} theem
Os - Raws li kev siv tau ruaj khov
03
Kev ntseeg tau
Kev sim siab ib puag ncig kev ntxhov siab: Temp Cycling (- 65 Degree ~ 200 degree), thiab hlawv / av noo / av.
04
Ntsug -} Tshwj xeeb
Automotive: AEC - q100 daim ntawv pov thawj
RF / HSIO: 5G / PCIOS NPLOS INCRATION
Nco: Kev Xeem Sib Tw Loj
05
Cim npe nrov: Xeem Ntawv Xeem Pawg Thawj, Tuam Tshoj Semiconductor kuaj Board tuam txhab, khoom muag, Hoobkas
