Kho qhov muag Transcecy pcb

Ib qho kho kho qhov muag transclu pcb yog cov boardcuital board ua raws li cov tub ntxhais substrate rau kev kho kho kho tshiab, nrog cov haujlwm tseem ceeb:
1. Electro {- optical interface: sib xyaw ua ke), thiab cdr chips rau hluav taws xob nrog teeb liab teeb liab hloov dua siab tshiab.
2. High {{- Ceev Kos Npe: Nta Rectherance {}}}}}}}}}}}}}}}}}}}} Txoj Kev Txhawb 25 224Gbps Ib Txoj kab.
3. Thermal kev tswj hwm: Embeds tooj liab thermal vias vias / channel rau kev txwv Laser lase Rose (Δt <5 degree).
4. High {{- ceev HDI (cov digital {}} DD: 18 × 89 × 9 mm³).
State-of-the-Art Data Rate:
Kev Lag Luam Tshaj Tawm: 1.6 TBPS (piv txwv, 800g- d8 OSFP Module, 8 × 112G PAM4 LANES)
Lab lav tsab Ntawv: 3.2 TBPS (silicon phponics + CPO Ntim, 16 × 200G PAM4 LANES)
Tom ntej no -} Nplooj lus qhia kom lom zem:
CPO (co {{{- Siv lub cav kho qhov muag thiab tshuab hluav taws xob kom txo cov hluav taws xob interconnect poob, phiaj paj nruag 3.2t +
Nyias - Niew WaveGuides: Embeds Optical WaveGuide txheej - me ntsis kho qhov muag

Xa kev nug

Cov yam ntxwv khoom

Ultra - high -} ceev signaling

Lane tus nqi: 56g NRZ RAU 224G PAM4 (LENT PRECTYPE 256G PAM6)
Cov teeb liab kev ncaj ncees:
- rreion poob <0.2 db / hli @ 112 Gz
-} Kev zam kev zam ± 5% (100ω qhov sib khub sib txawv)
{{0 {}} crosstalk supression<-40 dB

Cov ntaub ntawv tshaj lij & Stackup

Substrate Cov Khoom:
-} ultra-} Tsis muaj laminates (df tsawg dua {/ rogers clte {{mw)
-} Low CTE (3 ~ 6 ppm / degree) txuam nrog silicon photonics
Stackup tsim:
{{0- hybrid dielectric (siab - Ceev: NET3HT, POWER: FAISTEB: FR-4)
-} ultra- Cores (tsawg dua lossis sib npaug ntawm cov tw

Opto - hluav taws xob co -}}}} kev sib xyaw

Hybrid Sib Koom Tes:
{- silicon photonics flip -} 1. 1.5 μm qhov tseeb)
{{0- CPO (co {{1} {} artical cav <2} € asic spacing <500 μm, txo hwj chim 30%
WaveGuide kev sib xyaw:
- Thin - Nyeem zaj duab xis Polymer WaveGuides (poob <0.03 db / cm)

Precision Thermal Kev Tswj Xyuas

Cua txias daws:
-} microchanannel tooj liab substrates (thermal conductivity 400 w / mk)
{{0- high- ntom ntom thermal ntawm arrays (ø80 μm)
Tswj kub:
{{0- Laser Diode Temp nce δt <2℃(@ 10W fais fab)

High - ntom interconnect (HDI)

Microvia technology:
- i} laser dig muag vias ø40 μm, nam piv 1: 0.8
- -} txheej HDI
Xov ceev ceev:
-} lw dav|Qhov chaw 25/25 μm, {{} sib txuas / cm²

Ib puag ncig ruaj khov

Txwv tsis pub ua hauj lwm:
{{0-} muaj temp ntau -40℃~ 105℃(automotive 125 degree)
{{0} noo noo noo rhiab Qib MSL1 (85 Degree / 85% Rh, 168hrs)
Neeg kho tshuab zog:
- Kev Xeem 0G @ 50 ~ 2000 Hz, Poob Siab 1500G / 0.5ms

Khoom Daim Ntawv Thov Teb

Hypirale Cov Chaw Nruab Nrab

Cov Ntawv Thov:
{- Ai Kev cob qhia pawg (piv txwv li, nvlink kho qhov muag interconnect, 40tbps + / Khib)
- 800 g / 1.6t ethernet hloov (nplooj - spine npuag, 224g PAM4 txoj kab)
Cov Yuav Tsum Tau Ua:
-} ultra-} Tsawg Laminates (DF Tsawg dua lossis sib npaug nrog 0.001)
{{0- 3 d heetogenous kev koom ua ke (silicon photonics + cab)

5G / 6G Telecom Tes hauj lwm

Friethaul / Midhaul:
{{0- 25 g / 50G grey optics (auth- du txuas, latency<100μs)
{{0- 400 g zr / zr + coherent modules (Metro DWDM, mus txog 80km +)

Core Network:
-1.6t CPO Router LINE Phaib (Lub Hwj Pwm Ua Haujlwm<3W/Gbps)

HPC & Kev Txawj Ntse

GPU / XPU interconnects:
{{0 {}} Qhov muag rov kho dua tshiab (hloov tooj liab, 1.6tbps@8m)
{{0- Qua Quantum xam Option (Cryogenic Optical Links, 4k ua haujlwm)
Key Tech:
- thin - Nyeem zaj duab xis Polymer WaveGuides

Muaj & Tshwj Xeeb Teb Teb

Muaj iot:
- tsn optical terminals (jitter<1ns)
Kws muaj txuj ci tiv thaiv:
- cua dub -} nyuaj transce (satellite liercom, ber 10⁻¹²)
- Naval Radar Optical Txuas (ncua skew ± 0.5ps)

Cim npe nrov: Kho qhov muag TransceChaw module pcb, Suav kho qhov muag transclect modb manufacturers, lwm tus neeg, Hoobkas