Multilayer rigid - flex ntawv luam cov board

Ib tug hybrid luam cov board uas sib xyaw ua ke rigid substrates (rau kev txhawb nqa tshuab thiab kev siv tshuab lossis siv cov qauv sib xyaw los ntawm kev lamination. Nws ua rau cov multilayer sib txuas nrog cov ntu nruj thiab hloov pauv, tso cai rau peb {{1} {{{2} {} kev tsim qauv. Cov yam ntxwv tseem ceeb suav nrog:
1. Multilayer tsim kho: muaj ob lossis ntau txheej txheem coj ua;
2..
3. Kev sib txuas lus sib txuas lus: cov hluav taws xob txuas ntxiv ntawm cov chaw nruj thiab yoog raws li plated los ntawm kev cog lus los ntawm} qhov (vias) lossis txheej txheem sib tham.
Thawj cov ntawv thov: Cov khoom siv hluav taws xob yuav tsum muaj ob qho qauv kev ruaj ntseg thiab cov khoom siv hluav taws xob zoo nkauj (piv txwv li cov khoom siv smartphones), aerospace tshuab, khoom siv kho mob).

Xa kev nug

Tsis muaj

Cov yam ntxwv khoom

1. 3 d sib xyaw muaj peev xwm
Ua rau 3D kev coj ua tiav topology, hloov cov kev coj noj ua haus ib txwm- pcb + cable sib koom ua ke.

2. Cov kev sib tw tseem ceeb (Flex Zones)
Flex sections withstand >1 lab khoov mus khoov rau (ib iec 60335), min. Khoov radius: 0.5 hli.

3. Cov thev naus laus thev naus laus zis (cov aavid)
Rigid substrates (e.g., FR-4) provide component mounting with shock resistance >1000G.

4. Siab -} ntom interconnection
Ua tiav {20+ txheej txheej interconns ntawm laser Åμvias, LINE davth / tau txuas tsawg dua lossis sib luag rau 40μm.

5. Lub teeb yuag & nyias profile
60% thinner thiab 50% sib zog dua li cov pa "PCB + cov hlua khi" cov kev daws teeb meem.

6. Ib puag ncig lub zog
Kev khiav hauj lwm: {{{- 55℃rau +125℃(mil-p-50884 ua raws), tshuaj lom corrosion resistant.

Stack up

Khoom Daim Ntawv Thov Teb

Cov Neeg Siv Khoom Electronics

Foldable khoom siv: Pob khawm Circuitry (piv txwv li, Samsung Galaxy quav)
Wearables: nkhaus zaub cov tsav tsheb hauv smartwatches, tws ntseg pob ntseg them cov ntaub ntawv sib txuas

Aerospace & Tiv Thaiv

Satellite xa mus: Hnub ci array folding ncig (ciaj sia -120℃~ {{lurition}}℃thermal cycling)
Avionics: Radar Beam Thaum pib txo qis (40% kev txo phaus, 100g kev co tiv taus)

Cov Khoom Siv Kho Mob

Endoscopes: Articulating Ncej Kev Siv Hluav Taws Xob rau 360 Qib Kev Sib Hloov (> 50K Khoov Cycles)
Kiltables: multilayer rigid - flex hauv pacemakers (<0.3mm tuab, biocompible)

Automotive Electronics

Adas: MMWAVE RADAR FPC + Rigid Tswj Board (± 5% Impedance tswj)
BMS: High - voltage sampling ci ci hauv Ev lub roj teeb pob (2000V rho tawm voltage)

Muaj Tshuab

Robotic Caj npab: mult {- Cov lus tsa suab tswj cov paib (hloov 20 cables, ↓ 90% ua tsis tiav)
Daim Npav Prefension: Wafer Sectors Sensors Surche phaib (10μm Kab Dav, ± 1μm dlhos)

Cim npe nrov: Multilayer Rigid - flex ntawv luam cov board, Tuam Tshoj multilayer rigid {}} flex ntawv cim board manufacturers, lwm tus neeg, Hoobkas