Protruding tooj liab pcb

Protruding tooj liab PCB yog hais txog cov tuam txhab Circuit Court Faircuit Courtized 3D tooj liab qauv (50-200μm saum toj no cov dav hlau Nws cov tub ntxhais lub zog muaj xws li:
{1. 3 D kev sib txuas lus: Cov Tub Txib ua raws li txoj kev ntsug consivars tig rau rauv- potcot ntim, hloov cov khoom sib xyaw;
2. Thermal Kev Tswj Xyuas: Kev sib chwv ncaj qha nrog cua sov-}}}} Nplooj thermal tiv thaiv los ntawm 30% -50%;
3. High {{{{{} Nrhiav tam sim no: Cov ntaub qhwv hauv zos
Txheej Txheem Tseem Ceeb: ua siv msap (hloov kho semi - cov txheej txheem ntxiv) lossis cov qauv plating nrog photoresist masking.
Xa kev nug
Hauj lwm lawm

Cov yam ntxwv khoom

 

 

1. 3 d tooj lyrics} d toojtizer topology
50-200μm siab tooj liab pob / ncej (vs. tsawg dua lossis sib npaug ntawm 10μm kev sib luag hauv cov qauv PCBs) kom zoo nkauj thauj khoom thiab kho tshuab anchoring.


2. Hauv qab tus tooj liab tuab
200-400μm tooj liab tuab hauv cov chaw tseem ceeb (vs. tsawg dua lossis sib npaug nrog 704μm), muab 3-5x siab dua tam sim no muaj peev xwm.

 

3. Embedded Thermal Kev Tswj Xyuas
Direct chip-to-copper contact reduces thermal resistance by >40% (piv txwv li {. 30℃aigrt yos aigrws temp poob).


4. Precision tso
Photolithogrogrogrogy tiav ± 5μm sricignment tseeb nrog tsawg kawg 80μm pob hla.


5. Hybrid Khoom Sib Tw
Tau tshaj Cover - ceramic (aln) thiab tooj - resin comptrates.

 

Khoom Daim Ntawv Thov Teb

 
 

Lub hwj zog hluav taws xob

Tech Ntug: 400μm Hauv Zos Tooj Npav nqa 200a +, ua pob ncaj qha-} Txuas nrog igbt / sic tuag (40% qis dua rth)

Siv rooj plaub: EV lub cev muaj zog los, hnub ci inverers, muaj vfds

01

 

Xauv Ntim

Tech Ntug: 80μm Cu Pillars pab tau tsawg dua los yog sib luag rau 50μm- duab 2.5d / 3D% nqi (30% nqi txuag vs. tsv)
Siv cov xwm txheej: HBM cuam tshuam, chinstration koom ua ke substrates

02

 

Automotive high - voltage Systems

Tech Ntug: CU Breaks muab tshuab siv tshuab tog anchoring rau high tam sim no pob qij txha (Cwj Pwm
Siv rooj plaub: EV roj teeb tswj

03

 

High - zaus RF

Team Edge: CU Bebs daim foos λ / 4 WaveGuides (tsawg dua los yog sib luag rau 1℃theem yuam kev ntawm 77GHz)
Siv rooj plaub: 5g mmwave pub tes hauj lwm, satellite t / r modules

04

 

Aerospace Fais Fab

Tech Edge: Cu-AlN composites withstand -55℃~200℃ thermal cycling (>500 Cycles)
Siv rooj plaub: Lub zog hluav taws xob hloov pauv, cov mandacracacra miner

05

 

Cim npe nrov: Protruding tooj liab PCB, Suav teb tawm tooj liab PCB cov tuam txhab, cov chaw muag khoom, Hoobkas