Cov yam ntxwv khoom
1. 3 d tooj lyrics} d toojtizer topology
50-200μm siab tooj liab pob / ncej (vs. tsawg dua lossis sib npaug ntawm 10μm kev sib luag hauv cov qauv PCBs) kom zoo nkauj thauj khoom thiab kho tshuab anchoring.
2. Hauv qab tus tooj liab tuab
200-400μm tooj liab tuab hauv cov chaw tseem ceeb (vs. tsawg dua lossis sib npaug nrog 704μm), muab 3-5x siab dua tam sim no muaj peev xwm.
3. Embedded Thermal Kev Tswj Xyuas
Direct chip-to-copper contact reduces thermal resistance by >40% (piv txwv li {. 30℃aigrt yos aigrws temp poob).
4. Precision tso
Photolithogrogrogrogy tiav ± 5μm sricignment tseeb nrog tsawg kawg 80μm pob hla.
5. Hybrid Khoom Sib Tw
Tau tshaj Cover - ceramic (aln) thiab tooj - resin comptrates.
Khoom Daim Ntawv Thov Teb
Lub hwj zog hluav taws xob
Tech Ntug: 400μm Hauv Zos Tooj Npav nqa 200a +, ua pob ncaj qha-} Txuas nrog igbt / sic tuag (40% qis dua rth)
Siv rooj plaub: EV lub cev muaj zog los, hnub ci inverers, muaj vfds
01
Xauv Ntim
Tech Ntug: 80μm Cu Pillars pab tau tsawg dua los yog sib luag rau 50μm- duab 2.5d / 3D% nqi (30% nqi txuag vs. tsv)
Siv cov xwm txheej: HBM cuam tshuam, chinstration koom ua ke substrates
02
Automotive high - voltage Systems
Tech Ntug: CU Breaks muab tshuab siv tshuab tog anchoring rau high tam sim no pob qij txha (Cwj Pwm
Siv rooj plaub: EV roj teeb tswj
03
High - zaus RF
Team Edge: CU Bebs daim foos λ / 4 WaveGuides (tsawg dua los yog sib luag rau 1℃theem yuam kev ntawm 77GHz)
Siv rooj plaub: 5g mmwave pub tes hauj lwm, satellite t / r modules
04
Aerospace Fais Fab
Tech Edge: Cu-AlN composites withstand -55℃~200℃ thermal cycling (>500 Cycles)
Siv rooj plaub: Lub zog hluav taws xob hloov pauv, cov mandacracacra miner
05
Cim npe nrov: Protruding tooj liab PCB, Suav teb tawm tooj liab PCB cov tuam txhab, cov chaw muag khoom, Hoobkas




