Sab saum toj -} hauv qab asymmetric rigid - flex pcb

Ib qho siab tshaj -} hauv qab asymmetric rigid {}}}} flex pcb yog qhov ua rau muaj kev tsim kho ntawm cov khaubncaws sab nraud povtseg. Cov Qauv Tseem Ceeb xws li:
1. Ua haum zoning: Sab saum toj rigid cheeb tsam (piv txwv li, siab} ceev {} - nyias muaj nyias?
2. Asymmetric Stackup: >50% thickness aduction ntawm txheej (piv txwv li, 0.8mm fr4 sab saum toj vs 0.1mm pi hauv qab);
3. Hla -} txheej interconn: laser microvias (<60μm) penetrate rigid-flex interfaces for inter-zone routing;
4. Neeg kho tshuab ua haujlwm: CLEENTLLING hauv qab nqus SHOCK / kev co, txhav sab saum toj ua kom muaj kev sib xyaw ua ke.
Siv rau hauv cov ntawv thov uas xav tau kev ua kom siab siab {{0} Ua haujlwm ua thiab siv tshuab, cov khoom siv kho tshuab nrog cov khoom siv hluav taws xob.

Xa kev nug

Tsis muaj

Cov yam ntxwv khoom

1. Qauv Qauv
Z-Axis Heterogeneous Stackup: Top rigid zone (0.5-2.0mm) vs bottom flex zone (0.05-0.2mm), >50% thickness delta
Ntsug ua haujlwm zoning: Sab saum toj Mounts BGAS / hf IcS, hauv qab Enable Bended / Thermal Kev Tswj Xyuas
Asymmetric interconnect: Laser Microvias (tsawg dua los yog sib luag rau 60μm) los ntawm kev cuam tshuam, 15: 1 nam piv

2. Kev Ua Hluav Taws Xob Hluav Taws Xob
Hla - txheej teeb liab kev ncaj ncees: ± 3% kev zam kev zam @ 40ghz (hybrid DK tswj)
HF ISATION: 0.1Mm txuas nruab nrab ntawm sab saum toj thiab hauv qab cov paib kos npe, Crosstalk<-45dB
Tsis tshua muaj - poob kis:<0.15dB/cm@10GHz in flex bottom (LCP substrate)

3. Cov Khoom Siv Kho Tshuab
Neeg kho tshuab decoupling: sab saum toj tivthaiv kev ntxhov siab<10MPa when bottom flex bends at ≤0.3mm radius
Kev Poob Siab: Cov Txheej Txheej Ua 80% Kev Co Zog (Damped Cavity Sau)
CTE sib txuam: TOP CTE 14ppm /℃(FR4) VS hauv qab 20ppm /℃(PI),<5μm/100℃ thermal delta

4. Thermal Kev Tswj Xyuas
Dual Thermal Path: Top: Embedded Cu pillars (>400W/mK); Bottom: Thermal adhesive + metal core (>8W / MK)
Thermal Rho Tawm: Tsawg {{- λ-pi (0.1w / mk) nyob rau hauv high- fais fab aav

5. Kev ntseeg tau
Delamination Resistance: >1.2n / hli tev muaj zog ntawm interfaces (vs 0.8n / hli txheem)
Huab Temp Ciaj sia: -196℃(ln₂) ~ {{+260℃(rearow), 1000 cycles xoom tsis ua haujlwm
Cov ntaub ntawv pov thawj tshuaj lom neeg: Parylene encapsulation nyob rau hauv qab (resistions acid / alkali / bio {{mur} kua dej)

Stack up 1

Stack up 2

Khoom Daim Ntawv Thov Teb

1. Phased array radar

T / R module RF cam
Cov kav hlau txais xov hluav taws xob substrates
Radome -} embedded Systems

Kev kho mob kho tau

Hlwb pacemaker controllers
Cochlear implant processors
Subcutaneous flucose fluors

Foldable Uavs

Koojtis - mut tswj tswj lub cam
Gimbal Cov Qauv Ruaj Khov
3D Sensing modules

Chaw Xa Khoom

Hnub ci array tsav khoom siv hluav taws xob
Hluav taws xob - hatened computing
Rover npab pob qij txha

Automotive Electronics

Nkhaus automotive radar
Ntse lub rooj siab siab
BMS cov tswv yim tswv

Cim npe nrov: Sab saum toj -} hauv qab asymmetric rigid {}}} to tod {}} flex pcb manufacturers, lwm tus neeg, Hoobkas