Hybrid Cuam Tshuam PCB

Ib tug hybrid impedance pcb yog ib tug multilayer Circuit Court Board uas laminates cov ntaub ntawv heterogeneous thaum tswj hwm kom meej cov khaubncaws sab nraud povtseg, tus cwj pwm los ntawm:
1. Cov khoom siv hybridization: RF txheej (piv txwv li cov khaubncaws sab nraud povtseg (xws li ®) + digital khaubncaws sabdu (piv txwv li fr-4 / megtron ™)
2. Kev cuam tshuam txuas ntxiv: Kev hloov pauv mus tsawg dua lossis sib npaug ± 3% ntawm kev sib piv cov ntaub ntawv DK
3. 3 D txoj kev tswj hwm: Ntsug ntawm Impedance hloov<5%

Kev tseem ceeb
Cov Khoom Siv Stackup:
RF Txheej: Tsawg {{{{{}} poob dienaectric (dk =2.2 ~ 10.8, Tanδ<0.004)
Cov txheej digital: high - nrawm laminate (dk =3.5 ~ 4.5, tanδ<0.01)
Kev tswj qauv:
Graded Dk transition zone (length >3λ)
Laser Microvias (nam piv 1: 0.8, dia. Tsawg dua lossis sib npaug rau 100μm)
Cov ntsuas tseem ceeb:
Inter - txheej txheej crosstalk<-90dB @40GHz
Thermal cycling reliability >500 Cycles (-55 Degree ~ 125 degree)

Xa kev nug

Cov yam ntxwv khoom

Hla - Cov khoom siv impedance

Inter -} Substrate Kev Zam Txim Rau ± 3% (piv txwv li RO4350B ™ + FR-4)
Key Tech: DK Gradient Tsim (Transition δdk<0.2)

Rf - Cov digital co {{1} l} kev tsim

RF Txheej: 50ω Kev Tawm Tsam ± 1.5% (dav Tol. ± 0.015mm)
Digital Txheej: 90ω Diff. impedance ± 5%
Isolation: >90dB via shielding vias (>200 vias / cmol)

Kev tswj hwm 3D kev tswj hwm

Laser Microvia Impedance<5mΩ (aspect ratio 1:0.8)
COPPER Pillal Thermal Kuj<0.3℃/W

Cov teeb liab kev sib raug zoo

Poob ntxig<0.04dB/cm @28GHz (hybrid zone)
Rov qab poob<-20dB (broadband matching)

Thermo -} me tshuab kev ruaj khov

Z - Axis Cte Delta<8 ppm/℃ (RO3000™ vs FR-4)
Muaj sia nyob 500 thermal mus los (-55℃~ 125 degree)

Khoom Daim Ntawv Thov Teb

{{0 {{}} g mmwave loj mimo
Qhab: Rogers Ro3003 ™ (28 / 39GH tus kav hlau txais xov) + Ilota i {4 {}}}}}}}}}
Impedance:
Tus kav hlau txais xov pub: 50ω ± 1.5% (0.18mm dav)
Fpga tswj: 100ω txawv. 5%
Kev Ua Tau Zoo: Inter - channel theem yuam kev<0.8°, EIRP >70dbm

2. Satellite phased arrays
Cov ntaub ntawv: LTCC RF txheej (DK =7.1}}}}) + pi flex (cte- matched)
Tech:
Ka - band impedance hloov Δz<2%
Ribbon Tsevneeg (Inductance<0.05nH)
Ib puag ncig: Lub Tshuab nqus tsev khiav tawm txav<1% (-150℃~125℃)

3. CPO Optical Systems
Tus Qauv: Silicon Photonics Txheej (90ω) + PTFE RF txheej (50ω)
Cov tsis muaj:
11,Gbps Pam4 poob<3dB@56GHz
Mauxe hloov kev kam rau ± 3%
Cua txias: Embedded CU Curse (thermal res.<0.4℃/W)

4. Medical Imsing tshuab
Siv: 7T MRI RF chev cov laug cam
Kev daws:
300mHz Revononator Txheej (RO4350B ™)
Tswj txheej (FR-4, 75ω)
Key: Body coil impedance uniformity >98%

5. Automotive Domain Controllers
Qhov yuav tsum: 77GHz Sadar + Gigabget Ethernet Co - kev tsim
Tsim:
RADAR Txheej: RO4835 ™ (50ω ± 2%)
Ethernet txheej: Megtron6 (100ω Diff. ± 7%)
Isolation: EBG structures suppress crosstalk >30DB

Cim npe nrov: Hybrid Cuam Tshuam PCB, Tuam Tshoj Hybrid Cuam Tshuam PCB Cov Chaw Tsim Tshuaj, Chaw muag khoom, Hoobkas