Substrate Pretreatment: Ua kom muaj zog dua Bonding ntawm tooj liab ntawv ci thiab substrate
Thaum lub substrate thiab tooj liab ntawv nyiaj ntawm zoo tib yam rigid PCBs daim ntawv cog lus nruj, lub PI substrate ntawm FPCs muaj ib tug du nto, yuav tsum tau tshwj xeeb kev kho mob los xyuas kom meej ruaj tooj liab ntawv ci adhesion. Thaum lub sij hawm pretreatment, me me pits yog etched rau hauv PI zaj duab xis uas siv cov tshuaj tov tshuaj (xws li sodium hydroxide), ua raws li los ntawm ib tug adhesion txhawb (zoo ib yam li "kua nplaum"), thiab thaum kawg, kub nias los khi tooj liab ntawv ci rau lub substrate. Kev sim ntawm lub Hoobkas FPC qhia tau hais tias qhov adhesion ntawm pretreated tooj liab ntawv ci tuaj yeem ncav cuag 0.8 N / mm, ob zaug ntawm cov ntawv ci uas tsis tau kho, ua rau nws tsis tshua muaj detachment thaum khoov.
Kev tswj xyuas qhov ntsuas kub ua ntej thiab lub sijhawm yog qhov tseem ceeb. Qhov kub ntau dhau (siab dua 120 degree) tuaj yeem ua rau deformation ntawm PI substrate, thaum qhov kub tsis txaus ua rau kev kho tsis zoo. Cov kab ntau lawm ruaj khov qhov ntsuas kub ntawm 100℃± 2℃rau 3 feeb, txhim kho qhov sib xws ntawm cov ntawv ci tooj liab adhesion mus rau ntau dua 95%.
Circuit Fabrication: Etching Circuits ntawm "Elastic Film"
Circuit Court fabrication rau FPCs zoo ib yam li cov PCB nruj, koom nrog photolithography thiab etching, tab sis nws yog qhov nyuaj dua. Vim tias PI substrate nthuav dav thiab sib cog lus nrog cua sov, lub tshuab nqus tsev adsorption yog xav tau thaum lub sij hawm raug los kho lub substrate tiaj tus thiab tiv thaiv Circuit Court deformation. Lub siab -FPC ntom ntom (0.1 hli kab sib nrug) siv lub siab- lub tshuab ua kom pom tseeb nrog lub tshuab nqus tsev adsorption tau ua tiav kab sib txawv ntawm ± 10μm, 60% kev txhim kho tshaj ± 25μm ntawm cov tshuab raug pom zoo ib yam.
Thaum lub sij hawm etching, ib qho kua qaub (xws li ferric chloride) yog siv los tshem tawm cov ntawv nyiaj ntau dhau, khaws cov kab uas xav tau. Lub etching ceev rau FPCs yog 30% qeeb dua rau nruj PCBs vim hais tias ceev heev etching yuav ua rau burrs ntawm kab ntug. Ib qho FPC muaj kab sib nrug ntawm 0.08mm. Los ntawm kev txo cov etching ceev (los ntawm 1m / min mus rau 0.7m / min), cov kab ntug roughness raug txo los ntawm 5μm mus rau 2μm, tiv thaiv luv luv ntawm cov kab uas nyob ib sab.
Npog zaj duab xis Lamination: Muab cov kab ib "Kev Tiv Thaiv Suit"
Npog zaj duab xis lamination yog txheej txheem tseem ceeb tshwj xeeb rau FPCs. Ua ntej, ib txheej ntawm thermosetting nplaum yog siv rau lub npog zaj duab xis. Tom qab ntawd, lub npog zaj duab xis yog ua raws li cov kab los ntawm qhov chaw nyob, thiab thaum kawg, nws raug nias ua ke siv lub xovxwm kub (kub 160 degree, siab 0.5MPa, lub sijhawm 30 vib nas this). Cov npuas huab cua yuav tsum raug zam thaum lub sij hawm lamination, txwv tsis pub, cov kab yuav ntub thiab oxidize. Ib lub tuam txhab FPC siv "kauj ruam-los ntawm- kauj ruam lamination" txoj kev: ua ntej, qis- kub ua ntej- nias (100 degree) tshem tawm cua, tom qab ntawd siab - kub lamination txo cov npuas ntawm 5% mus rau 0.5%.
Lub thickness ntawm lub npog zaj duab xis yog qhov tseem ceeb heev. Nyias npog zaj duab xis (25μm) muab kev yooj yim dua tab sis tiv thaiv me ntsis; thicker cover films (50μm) muab kev tiv thaiv muaj zog tab sis nce kev ntxhov siab thaum khoov. Smartwatch FPCs feem ntau siv 35μm tuab npog zaj duab xis los tawm tsam qhov sib npaug ntawm qhov yooj yim thiab kev tiv thaiv.
Punching thiab Forming: Txiav rau hauv qhov xav tau
FPCs yuav tsum tau txiav rau hauv cov duab tshwj xeeb raws li cov qauv siv, feem ntau siv cov xuas nrig ntaus los yog laser txiav. Tuag xuas nrig ntaus yog tsim rau cov khoom loj nrog qhov tseeb ntawm ± 0.1mm. Piv txwv li, tuag xuas nrig ntaus yog siv rau kev tsim khoom loj ntawm lub xov tooj ntawm tes FPCs, ua tiav kev ua haujlwm ntawm 50 daim ib feeb. Laser txiav yog tsim rau cov khoom me me lossis cov duab nyuaj, nrog qhov tseeb ntawm ± 0.05mm. Piv txwv li, tsis zoo li FPCs rau cov khoom siv kho mob yog laser- txiav kom zoo kawg nkaus phim cov cuab yeej nkhaus.
Cov npoo txiav yuav tsum du thiab tsis muaj burrs; txwv tsis pub, khoov yuav tsim kua muag cover zaj duab xis. Lub laser txiav tsis ntawm ib tug tej yam FPC tau optimized (lub hwj chim 10W, ceev 50mm / s), ua rau ib tug ntug roughness Ra tsawg dua los yog sib npaug zos rau 1μm, ib tug 67% kev txhim kho tshaj lub unoptimized 3μm.
Kev kho deg: Ob leeg solderability thiab oxidation kuj yuav tsum tau.
FPC solder pob qij txha yuav tsum tau kho deg, feem ntau immersion kub thiab tin plating. Cov khaubncaws sab nraud povtseg kub yog nyias (0.05-0.1μm), tsis cuam tshuam rau kev hloov pauv, thiab haum rau zoo{12}}pitch solder pob qij txha (xws li, 0.3mm pitch chips). Tin plating txheej yog me ntsis thicker (1-3μm), tus nqi qis, tab sis tuaj yeem tsim cov tin whiskers (zoo tin crystals) thaum khoov. Lub ci kub tom qab tin plating (125 degree, 2 teev) yuav tsum tau tswj kom tsis txhob tin whisker loj hlob. Ib qho ntawm lub tsheb sensor FPC yog tin-plated, thiab tom qab ci, tin whisker ntev tau tswj kom qis dua 5μm, ua tau raws li cov qauv kev nyab xeeb hauv tsheb.
Cov Txheej Txheem Txhim Kho: Ntxiv ib lub phaj nruj rau qhov tseem ceeb
Thaum FPC hloov tau, cov cheeb tsam uas cov khoom siv tau soldered yuav tsum muaj qee qhov kev nruj nruj; Txwv tsis pub, deformation yuav tshwm sim thaum soldering. Yog li ntawd, ib lub phaj reinforcing (cov ntaub ntawv tuaj yeem yog PI, steel ntawv, lossis epoxy resin board), 0.1-0.5mm tuab, txuas rau sab nraum qab ntawm FPC siv cov nplaum. Qhov sib txawv ntawm qhov sib txawv ntawm cov phaj reinforcing yuav tsum tsis pub tshaj ± 0.1mm, txwv tsis pub nws yuav cuam tshuam cov pob qij txha. Nyob rau hauv ib lub kauj-toog npab ntse, tom qab txuas lub 0.3mm tuab PI reinforcing phaj rau lub roj teeb solder pob qij txha, soldering tawm los ntawm 90% mus rau 99%.